ChipQuik
The normal solder (63% Sn 37% Pb) has a melting temperature of 361F (183C). ChipQuik has a very low temperature solder (48% Sn 28%Pb 21%In 3%Bi) which has a melting temperature of 136F(58C). When ChipQuik solder combines with the regular solder, the new alloy has a melting temperature of 150F. So surface mount devices can be removed with the ChipQuick solder by keeping the solder molten with only 150F (low enough not to damage the devices).
